These Low Profile Hybrid DA Foam Pads engineered with foams that are more rigid, firm and dense to maintain it’s structural integrity during buffing (no loss of cutting) with a Dual Action Polisher. It’s thin design also allows for smoother handling and buffing feel.

Functions:
Designed to work with glazes to remove holograms and also applying waxes or sealants.

Attachment Method:
Hook and Loop